FUSION THERMAL PUTTY
FUSION Thermal Putty delivers premium performance with 8.0 W/mK thermal conductivity in a reusable, moldable format. Engineered for high-performance applications, this advanced compound provides excellent cooling for gaming systems and workstations with the flexibility to fit any surface.
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FUSION Thermal Putty offers exceptional thermal conductivity of 8.0 W/mK in a unique, reusable format. Developed with German precision, this high-performance thermal compound ensures optimal heat dissipation and can be easily shaped to fit any surface configuration.
The putty's moldable consistency makes it ideal for irregular surfaces, memory modules, VRM cooling, and components where traditional paste or pads may not conform properly. Unlike paste, thermal putty can be removed and reapplied multiple times without losing effectiveness, making it perfect for enthusiasts and system builders.
Engineered with German precision, FUSION Thermal Putty offers premium, reusable performance and is the perfect choice for those who demand advanced cooling solutions and the highest quality.
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